Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › In-process device with grooved coating layer on a semiconductor wafer for relieving surface tension

In-process device with grooved coating layer on a semiconductor wafer for relieving surface tension

US Patent 6621147 · Granted Sep 16, 2003

Estimated economic value: $4,026,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for providing ultrapure water2021
Recessed tape and method for forming a BGA assembly2005
Method for conserving a resource by flow interruption2003
Method and apparatus for screen printing2003
Method of relieving surface tension on a semiconductor wafer2002
Packaging die preparation2002
Method for conserving a resource by flow interruption2002
Method and apparatus for processing a planar structure2002
System for conserving a resource by flow interruption2002
Method of processing a wafer utilizing a processing slurry2002
Method and apparatus for processing a planar structure2002
Method and apparatus for screen printing2001