Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lithography method for forming semiconductor devices on a wafer utilizing atomic force microscopy

Lithography method for forming semiconductor devices on a wafer utilizing atomic force microscopy

US Patent 6620563 · Granted Sep 16, 2003

Estimated economic value: $19,914,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2025
High voltage blocking III-V semiconductor device2023
Switching circuit, gate driver and method of operating a transistor device2023
Charge trapping prevention III-Nitride transistor2019
Power semiconductor device with contiguous gate trenches and offset source trenc2017
III-nitride device with back-gate and field plate for improving transconductance2015
Wafer scribing method and wafer scribing device2005
Method for defining alignment marks in a semiconductor wafer2005
Method for defining alignment marks in a semiconductor wafer2005
Assembly comprising a plurality of mask containers, manufacturing system for man2005
Assembly comprising a plurality of mask containers, manufacturing system for man2005
Method for adjusting processing parameters of at least one plate-shaped object i2005