Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for high-density, low-via-count, decoupling capacitor placement

Method for high-density, low-via-count, decoupling capacitor placement

US Patent 6618266 · Granted Sep 9, 2003

Estimated economic value: $12,720,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device2010
Buffered memory architecture2010
Systems and methods of synchronizing reference frequencies2010
Low profile DIMM board2010
Component connector2007
Systems and methods for ensuring correct connectivity between circuit designs2006
Method and apparatus for mitigating electromagnetic waves2005
System for ensuring correct pin assignments between system board connections usi2005
Method for ensuring correct pin assignments between system board connections usi2003
Apparatus and method for delivering interrupts via an APIC bus to IA-32 processo2002
Mechanism for implementing bus locking with a mixed architecture2002