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Home › Repairable flip chip semiconductor device with excellent packaging reliability and method of manufacturing same

Repairable flip chip semiconductor device with excellent packaging reliability and method of manufacturing same

US Patent 6569708 · Granted May 27, 2003

Estimated economic value: $10,000 ⓘ

Assignee

Nec Electronics

Inventors

Tomohiro Kawashima (3 patents)

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