Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture

Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture

US Patent 6558976 · Granted May 6, 2003

Estimated economic value: $29,447,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit substrate light coupler2024
Strapdown heading sensors and systems, and methods of calibrating and compensati2022
Strapdown heading sensors and systems, and methods of calibrating and compensati2020
Anemometer2020
Strapdown heading sensors and systems, and methods of calibrating and compensati2019
Strapdown heading sensors and systems, and methods of calibrating and compensati2015
Optical-electrical MEMS devices and method2003
Critically aligned optical MEMS dies for large packaged substrate arrays and met2003
Method and apparatus for creating multiple phase level optical elements1993
Write-once-read-once batteryless authentication token1991