Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip scale and land grid array semiconductor packages

Chip scale and land grid array semiconductor packages

US Patent 6551859 · Granted Apr 22, 2003

Estimated economic value: $11,406,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lighting fixture2023
Lighting fixture2022
Lighting fixture2021
LED lighting fixture2020
Lighting fixture2019
LED lighting fixture2017
Leadframe packages having enhanced ground-bond reliability2012
Universal lead frame for micro-array packages2010
Electrical die contact structure and fabrication method2010
Apparatus and method for miniature semiconductor packages2008
Electrical die contact structure and fabrication method2008
Apparatus and method for packaging image sensing semiconductor chips2007