Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for specifying global abutment points in a semiconductor device having ambiguous submodule abutments

Method and apparatus for specifying global abutment points in a semiconductor device having ambiguous submodule abutments

US Patent 6546533 · Granted Apr 8, 2003

Estimated economic value: $2,382,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Holographic solar concentrator2015
Method and apparatus for constructing a global interconnect model of a device ha2004
Method for performing floorplan timing analysis using multi-dimensional feedback1999
Method for performing floorplan timing analysis by selectively displaying signal1999
Method for performing floorplan timing analysis using multi-dimensional feedback1999
Video system with XY addressing capabilities1987
Fiber optic movement measuring sensor1985