Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Panel stacking of BGA devices to form three-dimensional modules

Panel stacking of BGA devices to form three-dimensional modules

US Patent 6544815 · Granted Apr 8, 2003

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stackable flex circuit IC package and method of making same2007
Panel stacking of BGA devices to form three-dimensional modules2005
Panel stacking of BGA devices to form three-dimensional modules2003
Stackable flex circuit IC package and method of making same2003
Three-dimensional memory stacking using anisotropic epoxy interconnections2002
Stackable flex circuit chip package and method of making same2002
Stackable flex circuit IC package and method of making same2002
Panel stacking of BGA devices to form three-dimensional modules2002
Stackable flex circuit chip package and method of making same2002
Stackable flex circuit IC package and method of making same2001
Chip stack and method of making same2001
Modular panel stacking process1999