Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package

Semiconductor package

US Patent 6531762 · Granted Mar 11, 2003

Estimated economic value: $511,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Energy harvest and storage device for semiconductor chips and methods for formin2025
Method for parallelism-aware wavelength-routed optical networks-on-chip design2025
Substrate bonding pad having a multi-surface trace interface2023
Side contact pads for high-speed memory card2022
Printed circuit board trace for galvanic effect reduction2022
Semiconductor device including control switches to reduce pin capacitance2021
Stacked die package with curved spacer2021
Semiconductor device including dummy pull-down wire bonds2021
Heterogeneous fan-out structures for memory devices2020
RGB format adjustment and reconstruction method and circuit for depth frame pack2019
Semiconductor device including optional pad interconnect2019
Wire bonded wide I/O semiconductor device2019