Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System for assembling substrates to bonding zones provided with cavities

System for assembling substrates to bonding zones provided with cavities

US Patent 6531232 · Granted Mar 11, 2003

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process for producing an electromechanical device2018
Method for producing at least one deformable membrane micropump and deformable m2018
Device for the gravimetric detection of particles in a fluid medium, comprising 2014
Integrated multicomponent device in a semiconducting die2013
Method of producing a via in a reconstituted substrate2012
Thin film getter protection2011
3D integration of vertical components in reconstituted substrates2011
Encapsulated microcomponent equipped with at least one getter2010
Assembly and method of assembling by soldering an object and a support2010
Frequency filter and its manufacturing process2008
Method for making an anisotropic conductive polymer film on a semiconductor wafe2006
Mat element that has a distribution function2005