Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer conductive device interconnection

Multi-layer conductive device interconnection

US Patent 6508674 · Granted Jan 21, 2003

Estimated economic value: $33,534,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High reliability sheathed transport path for aerosol jet devices2024
Shuttering of aerosol streams2020
Shuttering of aerosol streams2020
Electromagnetic radiation shielding enhancement for expansion card enclosures2018
Hard drive carrier with vibration isolation2014
Low settle time micro-scanning system2013
Optically based planar scanner2013
Method and apparatus for a real time signal integrity oscilloscope2012
Waveform analyzer2011
Method and apparatus for a real time signal integrity oscilloscope2011
System and method for removal of frequency-dependent timing distortion2010
Method and apparatus for recording a real time signal2007