Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for measuring wafer thickness

Method for measuring wafer thickness

US Patent 6473987 · Granted Nov 5, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for double-sided imprint lithography2010
Hydro test apparatus and method for ammunition2007
Method and apparatus for polishing the edge of a bonded wafer2003
Machine for grinding-polishing of a water edge2003
Wafer notch polishing machine and method of polishing an orientation notch in a 2001
Wafer scrubbing machine2000
Seal assembly for a wafer grinding machine1994
Wafer centering assembly1991
Seal assembly for a wafer grinding machine1991
Wafer alignment fixture1990