Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wave solder application for ball grid array modules with plugged vias

Wave solder application for ball grid array modules with plugged vias

US Patent 6462285 · Granted Oct 8, 2002

Estimated economic value: $10,352,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wave solder application for ball grid array modules2004
Wave solder application for ball grid array modules2004
Wave solder application for ball grid array modules2004
Wave solder application for ball grid array modules and solder plug2001
Wave solder application for ball grid array modules and solder plug2001
Wave solder application for ball grid array modules and solder plug2001
Wave soldering process1997
Pressurized injection nozzle for screening paste1996
Circuit board having a defined volume of solder or conductive adhesive deposited1996
Method for applying bonding agents to pad and/or interconnection sites in the ma1995