Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer blade equipped with edge bumper

Wafer blade equipped with edge bumper

US Patent 6454327 · Granted Sep 24, 2002

Estimated economic value: $2,681,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for mounting a wafer in a polishing machine2002
Apparatus and method for transferring a torque from a rotating hub frame to a hu2002