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Home › Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies

Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies

US Patent 6439970 · Granted Aug 27, 2002

Estimated economic value: $3,113,000 ⓘ

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