Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate

Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate

US Patent 6435492 · Granted Aug 20, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die ejector2024
Method for detaching and removing a semiconductor chip from a foil2014
Method for picking up semiconductor chips from a wafer table and method for moun2012
Method for aligning the bondhead of a Die Bonder2006
Apparatus for mounting semiconductor chips2005
Die bonder and/or wire bonder with a device for holding down a substrate2003
Die bonder and/or wire bonder with a device for holding down a substrate2003
Die bonder and/or wire bonder with a device for holding down a substrate2003