Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for forming a dual damascene bond pad structure over active circuitry

Process for forming a dual damascene bond pad structure over active circuitry

US Patent 6417087 · Granted Jul 9, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Input/output cell wire connector2020
Solder bump structure for flip chip semiconductor devices and method of manufact2013
Electrostatic discharge protection circuit2012
Transistor fabrication method2011
Solder bump structure for flip chip semiconductor devices and method of manufact2011
I/O buffer with low voltage semiconductor devices2011
Formation of an integrated circuit structure with reduced dishing in metallizati2010
Voltage programming switch for one-time-programmable (OTP) memories2009
Electrical over stress robustness2009
Semiconductor device with constricted current passage2009
Integrated circuit with a trench capacitor structure and method of manufacture2009
Power pin to power pin electro-static discharge (ESD) clamp2009