Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dual-dies packaging structure and packaging method

Dual-dies packaging structure and packaging method

US Patent 6399421 · Granted Jun 4, 2002

Estimated economic value: $3,339,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for absorbing moisture within a face mask2023
Integrated circuit packages and the method for making the same2005
Integrated circuit packages and the method for making the same2005
Triple engine jet fighter double seater design2005
Triple engine jet fighter single seater2004
Method for determining failure rate and selecting best burn-in time2004
Method of fabricating an LC panel2003
Integrated circuit packages and the method for the same2003
Integrated circuit packages and the method for the same2003
Placement and routing for wafer scale memory2003
Long distance long range supersonic jet fighter2002
Method of forming package2002