Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for semiconductor device fabrication having copper interconnects

Process for semiconductor device fabrication having copper interconnects

US Patent 6380083 · Granted Apr 30, 2002

Estimated economic value: $8,766,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device having a barrier layer located therein and a method of manufacture theref2003
Plated through hole interconnections2002
Process for semiconductor device fabrication having copper interconnects2001
Method of producing a layer of superconductive oxide1995
Method of forming metal regions1993
Metallization for integrated devices1989
Method of repairing a defective photomask1987