Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Probe card, test method and test system for semiconductor wafers

Probe card, test method and test system for semiconductor wafers

US Patent 6356098 · Granted Mar 12, 2002

Estimated economic value: $8,055,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices with redistribution structures configured for switchable r2025
Semiconductor device assembly with die support structures2024
Semiconductor devices with redistribution structures configured for switchable r2023
Methods of manufacturing stacked semiconductor die assemblies with high efficien2023
Method of bonding a semiconductor device to a support substrate2023
Elevated pocket pixels, imaging devices and systems including the same and metho2023
Methods and systems for imaging and cutting semiconductor wafers and other semic2022
Apparatuses and methods for internal heat spreading for packaged semiconductor d2022
Stacked semiconductor die assemblies with high efficiency thermal paths and mold2022
Semiconductor devices with redistribution structures configured for switchable r2021
Chip scale light emitting device package with dome2021
Elevated pocket pixels, imaging devices and systems including the same and metho2021