Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a cover cap for semiconductor wafer devices

Method of forming a cover cap for semiconductor wafer devices

US Patent 6352935 · Granted Mar 5, 2002

Estimated economic value: $241,095,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Robust MEMS microphone2023
Robust MEMS microphone2022
Method for monitoring machine, device, and storage medium2022
Acoustic sensor with temperature structure2021
Piezoelectric micro-electro-mechanical systems (MEMS) device with a beam strengt2020
Method and system for processing product properties2016
Secure asset tracking system2015
Method and system for saving database storage space2014
Method of producing a MEMS device2013
Micromachined microphone and multisensor and method for producing same2012
Method and system for saving database storage space2012
Micromachined microphone and multisensor and method for producing same2010