Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making high-density, high-purity tungsten sputter targets

Method of making high-density, high-purity tungsten sputter targets

US Patent 6328927 · Granted Dec 11, 2001

Estimated economic value: $14,834,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Gold evaporative sources with reduced contaminants and methods for making the sa2018
Gold evaporative sources with reduced contaminants and methods for making the sa2017
Diffusion bonded high purity copper sputtering target assemblies2017
Method for forming sputter target assemblies having a controlled solder thicknes2015
Method for forming sputter target assemblies having a controlled solder thicknes2013
Method for consolidating and diffusion-bonding powder metallurgy sputtering targ2012
Method for consolidating and diffusion-bonding powder metallurgy sputtering targ2012
Method for forming sputter target assemblies2012
Ternary aluminum alloy films and targets for manufacturing flat panel displays2012
Ternary aluminum alloy films and targets for manufacturing flat panel displays2012
Ultrafine-grain-copper-base sputter targets2011
Controlled-grain-precious metal sputter targets2010