Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bump bonding and sealing a semiconductor device with solder

Bump bonding and sealing a semiconductor device with solder

US Patent 6313529 · Granted Nov 6, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Automotive door beam made of aluminum alloy extruded material2025
High strength aluminum alloy extruded material excellent in stress corrosion cra2020
Method for producing 7000-series aluminum alloy member excellent in stress corro2019
Free-machining aluminum alloy extruded material with reduced surface roughness a2017
7xxx series aluminum alloy member excellent in stress corrosion cracking resista2017
Aluminum alloy extruded material for electro-magnetic forming2015
Method for manufacturing an extruded material of heat treatment type Al—Zn—Mg se2014
Semiconductor device capable of restricting coil extension direction and manufac2013
Optical device having optical waveguide and method for manufacturing the same2007
Semiconductor device and method for producing the same by dicing2006
Semiconductor device having passivation cap and method for manufacturing the sam2006
Method for manufacturing a dynamic quantity detection device2005