Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Spacer - defined dual damascene process method

Spacer - defined dual damascene process method

US Patent 6303489 · Granted Oct 16, 2001

Estimated economic value: $3,616,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mitigation of silicide formation on wafer bevel2014
Mitigation of silicide formation on wafer bevel2013
Method for fabricating a semiconductor device2010
Methods for controlling the profile of a trench of a semiconductor structure2009
Menuing method and system2004