Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder thieving pad for wave soldered through-hole components

Solder thieving pad for wave soldered through-hole components

US Patent 6292372 · Granted Sep 18, 2001

Estimated economic value: $26,046,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Jumper cable module2004
System and method for modifying configuration files in a secured operating syste2003
Heat sink and attachment process for electronic components1999
Apparatus for holding samples during solderability testing1990
Adaptive signal receiving method and apparatus1984
Treatment of a substrate surface to reduce solder sticking1983