Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked multi-chip modules using C4 interconnect technology having improved thermal management

Stacked multi-chip modules using C4 interconnect technology having improved thermal management

US Patent 6278181 · Granted Aug 21, 2001

Estimated economic value: $5,111,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Temperature and/or voltage independent voltage controlled oscillator with progra2013
Temperature and/or voltage independent voltage controlled oscillator with progra2012
Random number generation apparatus and method2009
Method and apparatus for tunneling leakage current compensation2004
Bottom side C4 bumps for integrated circuits2001
Using polysilicon fuse for IC programming2001
Output buffer with protective limit of voltage across terminals of devices withi2000
Level shifter with protective limit of voltage across terminals of devices withi2000
Processor with short set-up and hold times for bus signals2000
High speed gate oxide protected level shifter1999
Reference voltage generation scheme for gate oxide protected circuits1999
Cross clock domain clocking for a system using two clock frequencies where one f1999