Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packaging systems and methods that use the same packaging substrates for integrated circuits of different data path widths

Integrated circuit packaging systems and methods that use the same packaging substrates for integrated circuits of different data path widths

US Patent 6274931 · Granted Aug 14, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for processing image, and vehicle having the same2025
Display device2025
Display device with recess in insulating films2025
Display device2025
Display device2025
Display device2025
Ultralow concentration sensing of bio-matter with perovskite nickelate devices a2025
Display device including protective window2025
Display device and electronic watch including the same2025
Ternary composite material, supercapacitor, and related methods2025
Composite electrodes for supercapacitors, ternary materials with flower-like mol2025
Emissive display device2024