Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonding process

Bonding process

US Patent 6273985 · Granted Aug 14, 2001

Estimated economic value: $14,743,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microfluidic device and method of manufacturing the microfluidic device2016
Microfluidic device and method of manufacturing the microfluidic device2016
Hybrid target analyte responsive polymer sensor with optical amplification2014
Method of enriching stem and/or progenitor cells2014
Ink jet set for reducing intercolor bleed2007
Aqueous ink compositions2005
Ink jet printing process2005
Conductive polymeric composites, articles and processes for the preparation ther2003
Ink jet printing process2003
Bonding process2002
Bonding process2002
Support structure for large channel plates of an ink jet printhead2002