Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Batch process for forming metal plugs in a dielectric layer of a semiconductor wafer

Batch process for forming metal plugs in a dielectric layer of a semiconductor wafer

US Patent 6242345 · Granted Jun 5, 2001

Estimated economic value: $2,611,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems, devices, and methods for preventing burns2022
System and method for determining position of a receiver relative to a transmitt2021
Method for depositing a flow fill layer on an integrated circuit wafer1999
Batch process for forming metal plugs in a dielectric layer of a semiconductor w1999
Method for depositing a flow fill layer on an integrated circuit wafer1997