Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High aspect ratio contact structure for use in integrated circuits

High aspect ratio contact structure for use in integrated circuits

US Patent 6239025 · Granted May 29, 2001

Estimated economic value: $34,457,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process for fabricating an electrical circuit comprising a polishing step2006
Integrated circuit with stop layer and associated fabrication process2004
Process for producing a resistor in an integrated circuit and corresponding inte2003
Semiconductor substrate having an isolation region2003
Method of forming insulated metal interconnections in integrated circuits2002
Integrated circuit and associated fabrication process2002
Integrated circuit with stop layer and associated fabrication process2002
Method of forming planar isolation in integrated circuits1998
Method for determining the complete elimination of a thin layer on a non planar 1993