Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrostatic device for supporting wafers and other components for use at temperatures of up to 230.degree. C.

Electrostatic device for supporting wafers and other components for use at temperatures of up to 230.degree. C.

US Patent 6215641 · Granted Apr 10, 2001

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manipulating wafers2008
Powders for producing hard materials in short reaction times for filling hollow 1991