Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same

Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same

US Patent 6201309 · Granted Mar 13, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Material species identification system using material spectral data2024
Slurry, all solid state battery and method for producing all solid state battery2024
Fluoropolyether compound, lubricant, and magnetic disk2024
Slurry, all solid state battery and method for producing all solid state battery2023
Three-dimensional additive manufactured product and three-dimensional additive m2023
Anode active material and battery2023
Positive electrode material and secondary battery using same2021
Negative electrode material including lead fluoride coated active material and e2021
Cooling mechanism of combustion chamber, rocket engine having cooling mechanism,2020
Fan motor lead wire protection member2018
Laser processing machine and laser processing method2015
Low-temperature curable conductive paste for plating and electric wiring using t2015