Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of double-side lapping a wafer and an apparatus therefor

Method of double-side lapping a wafer and an apparatus therefor

US Patent 6196901 · Granted Mar 6, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cable and/or the like supporting and guiding device2006
Data reproducing device, data reproducing method, and information terminal2005
Non-contact power supply system and apparatus and carrying equipment using the s2001
Method of double-side lapping a wafer and an apparatus therefor1999
Surface inspection method, surface inspection apparatus, and prism1999
Managing method of a run of moving objects1991
Apparatus for dressing cutting edge1987
Automatic guided vehicle1987