Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming an interposer for making temporary contact with pads of a semiconductor chip

Method for forming an interposer for making temporary contact with pads of a semiconductor chip

US Patent 6188231 · Granted Feb 13, 2001

Estimated economic value: $30,258,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Emergency stairwell for multistory buildings2003
Method and apparatus for preventing thermal failure in a semiconductor device th2002
Micro probe and method of fabricating same2002
Micro fusible link for semiconductor devices and method of manufacture2001
Micro fusible link for semiconductor devices and method of manufacture2001
Cooling method for silicon on insulator devices2001
Method for fabrication of silicon on insulator substrates2001
Micro probe ring assembly and method of fabrication2001
Method for fabrication of silicon on insulator substrates2001
Apparatus for removing slurry particles2001
Laser fusible link2000
Micro probe assembly and method of fabrication2000