Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer circuit substrate having orthogonal grid ground and power planes

Multi-layer circuit substrate having orthogonal grid ground and power planes

US Patent 6184477 · Granted Feb 6, 2001

Estimated economic value: $3,107,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor for detecting angular velocity2019
Wiring substrate for mounting semiconductor components2007
Optical integrated circuit substrate and optical module2004
Optical module and method for manufacturing same2003
Optical waveguide and process for producing same2002
Multilayer circuit board2001
Method for manufacturing optical waveguide using siloxane polymer, and optoelect2000
Electronic circuit component2000
Method for manufacturing optical waveguide using siloxane polymer, and optoelect1999
High performance and high capacitance package with improved thermal dissipation1997
High performance and high capacitance package with improved thermal dissipation1997
Superconducting circuit sub-assembly having an oxygen shielding barrier layer1995