Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Arrangement for reducing bending stress in an electronics package

Arrangement for reducing bending stress in an electronics package

US Patent 6180241 · Granted Jan 30, 2001

Estimated economic value: $50,037,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carbon nanotube-based structures and methods for removing heat from solid-state 2011
Method and apparatus for evaluation and improvement of mechanical and thermal pr2011
Composite carbon nanotube-based structures and methods for removing heat from so2011
Apparatus for attaching a cooling structure to an integrated circuit2009
Apparatus and method for the application of prescribed, predicted, and controlle2008
Moisture-resistant nano-particle material and its applications2008
Apparatus and test device for the application and measurement of prescribed, pre2007
Optical fiber with nano-particle cladding2007
Optical fiber with nano-particle overclad2007
Coated optical glass fiber2003
Optical fiber interconnect having offset ends with reduced tensile stress and fa2003
Bi-material assembly adhesively bonded at the ends and fabrication method2002