Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density electrical interconnect system having enhanced grounding and cross-talk reduction capability

High density electrical interconnect system having enhanced grounding and cross-talk reduction capability

US Patent 6179663 · Granted Jan 30, 2001

Estimated economic value: $12,709,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Connection system for tiered stages2022
Connection system for tiered stages2021
Connection system for tiered stages2020
Constant impedance connector system2020
Constant impedance connector system2019
Constant impedance connector system2019
Constant impedance connector system for quantum computer applications2018
Method and apparatus for making an interconnection between power and signal cabl2017
High speed, high density interconnection device2012
Method of manufacturing an interconnection device2009
Interconnection device2007
High speed, high density interconnect system for differential and single-ended t2006