Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging die preparation

Packaging die preparation

US Patent 6162703 · Granted Dec 19, 2000

Estimated economic value: $13,738,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and systems for imaging and cutting semiconductor wafers and other semic2022
Method and apparatus for providing ultrapure water2021
Methods and systems for imaging and cutting semiconductor wafers and other semic2017
Methods and systems for imaging and cutting semiconductor wafers and other semic2013
Electronic devices2013
Electronic device package2012
Methods and systems for imaging and cutting semiconductor wafers and other semic2011
Methods for assembling semiconductor devices and interposers2009
Interposers with receptacles for receiving semiconductor devices and assemblies 2007
Moisture-resistant electronic device package and methods of assembly2006
Moisture-resistant electronic device package and methods of assembly2005
Recessed tape and method for forming a BGA assembly2005