Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Enhanced heat dissipating chip scale package method and devices

Enhanced heat dissipating chip scale package method and devices

US Patent 6160311 · Granted Dec 12, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semantic analysis apparatus, method, and non-transitory computer readable storag2019
Information searching method and system based on geographic location2016
Stacked chip scale package structure2003
Structure of plated wire of fiducial marks for die-dicing package2003
Packaging process for wafer level IC device2002
Method for fabricating a dual-chip package and package formed2002
Method for wire bonding a chip to a substrate with recessed bond pads and device2001
Dual-sided heat dissipating structure for integrated circuit package2001
Dual-sided heat dissipating structure for integrated circuit package2001
Thin enhanced TAB BGA package having improved heat dissipation2000
Thin enhanced TAB BGA package having improved heat dissipation2000
Multi-chips semiconductor package and fabrication method2000