Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit chip package and method of making the same

Integrated circuit chip package and method of making the same

US Patent 6124546 · Granted Sep 26, 2000

Estimated economic value: $6,800,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Intercom signal mixer having channel tiles2022
Thermal interface material and semiconductor component including the thermal int2013
Circuit module and method2012
Method of integrated circuit packaging2009
Customizable presentation environment2007
Semiconductor component and method of manufacture2005
Universal carrier tray2002
Integrated circuit package incorporating camouflaged programmable elements2002
Method for marking semiconductor device using a green laser2002
Folding leg mechanism2001
Restraining device for tab carrier magazines1993
Methods of making optical fiber and products produced thereby1990