Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same

Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same

US Patent 6120716 · Granted Sep 19, 2000

Estimated economic value: $183,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Service providing mobile unit2025
Iron-based mixed powder for powder metallurgy and iron-based sintered body2025
Heat exchanger2025
Heat exchanger and method of manufacturing heat exchanger2025
Iron-based powder for dust cores and dust core2025
Power converter, power conversion controller, and control method2025
Heater and glow-plug provided therewith2024
Electric motor speed control apparatus and electric motor speed control method2024
Alloyed steel powder for powder metallurgy and iron-based mixed powder for powde2024
Fe-based nanocrystalline alloy powder, magnetic component, and dust core2024
Surveillance camera2024
Rotating electric machine2024