Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for testing a flip chip integrated circuit package adhesive layer

Apparatus and method for testing a flip chip integrated circuit package adhesive layer

US Patent 6117695 · Granted Sep 12, 2000

Estimated economic value: $14,671,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D-interconnect2025
Method of forming a region shielding within a package of a microelectronic devic2025
3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna2024
Region shielding within a package of a microelectronic device2024
3D-interconnect2024
3D-interconnect2021
3D-interconnect2019
Electronic device package and method of manufacture2013
Electronic device package and method of manufacture2011
Semiconductor package and process utilizing pre-formed mold cap and heatspreader2008
Semiconductor package having a thermally and electrically connected heatspreader2005
Direct positive image photo-resist transfer of substrate design2005