Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same

Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same

US Patent 6116495 · Granted Sep 12, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Printed circuit board and method for producing a printed circuit board2007
Printed circuit board for electrical and optical signals and method for producin2004
Circuit-board overlaid with a copper material on both sides or in multiple layer1999
Circuit-board overlaid with a copper material on both sides or in multiple layer1999
Circuit-board overlaid with a copper material on both sides or in multiple layer1999
Circuit-board overlaid with a copper material on both sides or in multiple layer1999
Circuit-board overlaid with a copper material on both sides or in multiple layer1999
Circuit-board overlaid with a copper material on both sides or in multiple layer1999
Process for producing fiber-reinforced light-metal castings1987
Process for manufacturing fiber reinforced light metal castings1986
Cooling tower with elevated heat exchanger elements supported on girders1982