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Home › Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon

Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon

US Patent 6109775 · Granted Aug 29, 2000

Estimated economic value: $21,268,000 ⓘ

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