{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for forming a semiconductor device", "item": "https://www.patentleaderboard.com/patent/6107187"}]}
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Method for forming a semiconductor device

US Patent 6107187 · Granted Aug 22, 2000

Estimated economic value: $32,942,000 ⓘ

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