Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for endpoint detection for chemical mechanical polishing

Method and apparatus for endpoint detection for chemical mechanical polishing

US Patent 6106662 · Granted Aug 22, 2000

Estimated economic value: $5,429,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Adapting service level policies for external latencies2022
Display screen or portion thereof with a transitional graphical user interface2022
Lithography optics adjustment and monitoring2020
Target assignment projectile2019
Lithography optics adjustment and monitoring2019
Adjusting an amount of coherence of a light beam2019
Lithography optics adjustment and monitoring2018
Target assignment projectile2018
Adjusting an amount of coherence of a light beam2018
Target assignment projectile2017
Quantifying utilization of a data storage system by a virtual storage unit2016
Apparatus for precision insertion2015