Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin composition and heat-resistant, returnable IC tray obtained by molding the same

Resin composition and heat-resistant, returnable IC tray obtained by molding the same

US Patent 6103818 · Granted Aug 15, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Treatment liquid for semiconductors and method for producing same2025
Semiconductor wafer processing liquid containing hypobromite ions and PH bufferi2025
Information processing device, information processing method, and non-transitory2025
Semiconductor wafer treatment liquid and production method thereof2025
Treatment liquid for semiconductor with ruthenium and method of producing the sa2025
Power amplifying circuit2025
Treatment liquid for semiconductor wafers2025
Radio-frequency module and communication device2024
Network synchronization system and synchronization method for network system2024
Onium salt-containing treatment liquid for semiconductor wafers2024
Heat exchanger and refrigeration cycle apparatus2024
Inhibitor for RuO4 gas generation and method for inhibiting RuO4 gas generation2024