Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material

Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material

US Patent 6102267 · Granted Aug 15, 2000

Estimated economic value: $48,022,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thin material handling carrier2023
System and method for providing an electron blocking layer with doping control2018
Handheld device with multiple displays2016
System and method for providing an electron blocking layer with doping control2016
Method and system for an organic light emitting diode structure2016
Semiconductor optical emitting device with grooved substrate providing multiple 2015
Semiconductor optical emitting device with metallized sidewalls2015
Semiconductor structure with waveguide2015
System to identify whether a text message is from a trusted source2014
Digital television with improved input selection functionality2014
Enhanced mobile device having multiple housing configurations2014
Optical disk playback device with three-dimensional playback functionality2014