Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure of a bonding pad for semiconductor devices

Structure of a bonding pad for semiconductor devices

US Patent 6100573 · Granted Aug 8, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package, package structure and method of manufacturing the same2025
Disinfection device2024
Electrical components having metal traces with protected sidewalls2019
Thin film transistor, pixel structure and method for fabricating the same2015
Light emitting diode with current blocking region2012
Method of fabricating mixed-mode device2000
Method of fabricating mixed-mode device2000
Method for observing tungsten plug of semiconductor device microscopically1999
Field effect transistor without spacer mask edge defects1996