Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Top mounting arrangement for a heat exchange module

Top mounting arrangement for a heat exchange module

US Patent 6092591 · Granted Jul 25, 2000

Estimated economic value: $133,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heat sealed packaging assemblies and methods of producing and using the same2024
Heat sealed packaging assemblies and methods of producing and using the same2021
Combined cycle power plant2020
Return shipping system2019
Multi-layered suspension package assembly2019
Nozzle and nozzle assembly configured to minimize combined thermal and pressure 2017
Method and configuration to reduce fatigue in steam drums2016
Compressible packaging assembly2016
Compressible packaging assembly2015
Multi-layered suspension package assembly2015
Foldable packaging member and packaging system using foldable packaging members2014
Suspension packaging system2014